LQ (-40℃~ -110℃)

FEATURES:

Used for cooling gas (non-corrosive): normal temperature gas such as dry compressed air, nitrogen, argon, etc. is passed into the LQ series equipment, the gas out can reach the target low temperature temperature, and the component or heat exchanger that needs to be tested can be supplied middle.

Product Description:
Gas heat exchange system withstand pressure 20bar
The temperature range is from -40°C to -110°C, which can meet different temperatures;
All use environmentally friendly refrigerants;
Using secondary subcooling technology, rapid cooling and low limit temperature;
Adopt well-known brand compressors, mainly self-branded as Carlisle and Emerson;
The cold box uses plate heat exchangers and tube heat exchangers, which are small in size and high in efficiency;
Adopt a full set of high-quality cold controls (Danfoss pressure controller, balance valve, expansion valve, solenoid valve, filter drier, Emerson oil separator, ALCO sight glass, one-way valve, etc.);
Adopt Danfoss expansion valve and Emerson electronic expansion valve;
Using Siemens S7 PLC, 7-inch touch screen, automatic control operation, and with temperature curve display, temperature record U disk, fault alarm record;
The whole machine is installed, the system has been tested in the factory, and the user only needs to install the power supply, gas pipeline, and cooling water pipeline before it can run;
Factory test: Each unit is tested in the factory with load for no less than 12 hours;
Factory test standard: ambient temperature 20 degrees, cooling water temperature 20 degrees, 6bar dry compressed air;

APPLITIONS：
Automotive sensors；Vehicle control products；Electronic control units or ECUs；Incoming parts inspection；Semiconductor IC verification；Simuation-based tesing；Cooling heating stress full cycle；Desgin or fabrication weakness；Fast hot&cold thermal cycling；Electronic and mechanical subsystems；Core module chip test；Auxiliary module chip test；MCU chip test；Microcontroller Unit chip test.

Products deliver a wide range of temperatures from cryogenic to high heat for thermal conditioning in electronic and production test of sensors, modules and subassemblies.