VPE manufactures custom diffusion bonded microchannel heat exchangers (MCHEs), also known as printed circuit heat exchangers (PCHEs), for a diverse range of industries. Furthermore, these compact heat exchangers are ideally suited for high-pressure and high-temperature applications.
Inside a Diffusion Bonded Microchannel Heat Exchanger
A general overview of fabricating a diffusion bonded microchannel heat exchanger, also known as a printed circuit heat exchanger:
- The thermal engineering team calculates the design needed to meet the requirements of the heat exchanger.
- An outside manufacturer etches plates or shims with the flow design.
- VPE assembles the shims in a counter-flow configuration.
- The stacked plates are diffusion bonded to create a solid heat exchanger core without gaskets. Perfected since 1976, VPE’s proven diffusion bonding process ensures parent material strength throughout the core of the heat exchanger.
- The diffusion bonded core is machined to size at VPE’s machine shop.
- The welding team joins the required manifolds, flanges, and components to the core of the heat exchanger.
- VPE carefully cleans and tests the heat exchanger to verify it is leak-proof.
- VPE’s diffusion bonded microchannel heat exchangers are “U” or “UM” stamped and meet the requirements of the ASME Boiler and Pressure Vessel Code.