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Products and Solutions for Semiconductor IC Test

production include burn-in, electronic hot and cold testing at temperature, and other environmental test simulations. These semiconductor devices and electronics, once put in real world applications, can get exposed to extreme environmental conditions.
Product engineers and test engineers in the lab and on the semiconductor production oor use and share the ThermalAir temperature forcing systems to bring their devices to temperature ranges from -55°C to +125°C.
ThermalAir environmental temperature test systems generate a hot and cold air stream directly on the device under test (DUT).
The LNEYA AES series has a temperature range from -120°C to +300°C, without the use of LN2 or CO2. Our portable self-contained thermal inducing systems only need to be plugged in. This lets you easily temperature test your electronic semiconductor IC devices.

Etching Groove

When replacing the etching solution, the process temperature of the etching tank must be restored quickly in order to accurately maintain the temperature within the target range.

Wet Etching Process

Because of the chemical change of the resist, the exposed area shall be removed by wet chemical etching process. In particular, the temperature of the etching bath has a direct impact on the etching rate and the dissolution rate of the reaction products.

Failure Analysis

Generally speaking, the test after packaging includes high temperature, room temperature, low temperature, sampling test and so on. Excessive temperature will accelerate the failure of electronic components.

Vapor Deposition

The process of forming solid deposits by using gaseous or vapor substances to react on the gas phase or gas-solid interface. The reaction temperature is too high, generally at 850-1100 ℃, and many matrix materials can not withstand the high temperature of CVD. The deposition temperature can be reduced by plasma or laser assisted technology.

Probe Test

The probe card of the optical device aging test system can keep the device at the working temperature during the aging process, so it needs to have high-power heat dissipation and cooling capacity.

Environmental Simulation

Temperature and humidity requirements for IC test environment after packaging: temperature: – 5 ~ 30 ℃, relative humidity: 20% ~ 75%. This temperature needs to be maintained during continuous test.

Photoresist Cleaning

The remaining photoresist mask is transferred to the underlying layer using a dry etching process. Oxide protrusions must be accurately removed and residues must be removed again. It requires an etching bath, and the temperature also has a direct impact on the etching rate.

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Products Cases

Semiconductor Technology-Chip Burn-in Test
Chip Design Research Institute – Wafer Testing
Semiconductor Materials Company-Manufacture
Semiconductor Technology Company – Processing and Testing


In the manufacturing of semiconductor chip components, temperature related problems such as etching groove, etching solution, photoresist removal and aging test. The temperature affects the dissolution rate of the reaction product, but the reaction product must be dissolved immediately so that the etching solution will not be polluted. When replacing the etching solution, the correct temperature of the etching tank can be restored quickly to ensure the stability of the production process, because even a little temperature deviation may cause serious losses.

High Precision Temperature Control In Research, Development

Research & Development
LNEYA units provide stable and predictable temperature control. This performance removes an unpredictable variant from the research.

Analytical Laboratory
These labs commonly use simple chillers to remove heat from sensitive Analytical instruments.

Scale Up
The rapid response of SUNDI series make them a common feature to keep the increased energy in larger reactions under tight temperature control.

Can be “low” or “high” volume batches.

Used for the temperature control of the etching bath for wet chemical manufacturing of wafers and microchips, as well as the IC packaging and production test stages including temperature simulation and component cooling during the electronic thermal test process.

Improving the etching rate of the wet chemical process and the speed of the dissolution of reaction products. Solve the temperature lag problem of electronic components to meet the use of electronic products exposed to extreme environmental conditions after they are offline.

Quality Control
Procedure intended to ensure that raw ingredients, purchased compounds etc. a finished product under development or a finished product is within specification.

Products & Solutions

SUNDI series -10℃ ~ 200℃

High precision, intelligent temperature control. Multi-function alarm system and safety function, 7-inch, 10-inch color TFT touch screen graphic display, magnetic drive pump, no shaft seal leakage problem.


TES series -70℃ ~250℃


TES series -85℃ ~200℃


UC series 50℃ ~200℃

UC series with function form high temperature to cooling process,form 300℃~50℃.

Equipped with heating cooling container,with large heat transfer area,fast heat-up and cool-down,small heat transfer oil demand.


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Process Thermostats

Many process steps are associated with precise temperature control applications. For example, in the etching process, a small temperature deviation will also cause serious losses, and a large number of wafer components will be directly scrapped. The etching bath should also be within the accurate temperature range, because it has a direct impact on the etching rate. The chemical solution (etching solution) reacts more rapidly with the increase of temperature, which is that the temperature also affects the dissolution rate of reaction products.

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